SECO Launches COM Express EUPHORIA with Intel® Atom® x6000E Series, Intel® Pentium® and Celeron® N and J Series Processors
- February 22, 2023
SECO S.p.A. (Italy) - High performance and integrated connectivity on x86 architecture with integrated IoT features. SECO, a leading provider of em...
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Cervoz Announces New Industrial-Grade T441 PCIe Gen 4x4 SSD
- February 09, 2023
Cervoz Co., Ltd. (Taiwan) - Press Release: The Cervoz T441, NVMe PCIe Gen 4x4 SSD, compared to its predecessor the PCIe Gen. 3 interface, offers twice...
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Targeting AI & Computer Vision, Innodisk Launches New Camera Module Series
- December 02, 2022
Innodisk Corporation (Taiwan) - Innodisk, a global leader in industrial-grade storage and embedded peripherals recently announced its shift towards th...
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Congatec Welcomes COM Express 3.1 Specification with Compliant Computer-on-Modules
- November 29, 2022
Congatec (Germany) - Press Release: Performance boost now standard-compliant. congatec – a leading vendor of embedded and edge computing tech...
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New Siemens SIWAREX WP341 Weighing Module
- November 23, 2022
Siemens (Germany) - Press Release: The clever and sustainable alternative to the weighing terminal. Conveyor belt scales are used wherever mat...
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onsemi Launches Automotive Silicon Carbide-Based Power Module Trio for On-Board Chargers
- October 07, 2022
onsemi (United States) - The APM32 series modules enable faster charging and increased range for all types of electrical vehicles. onsemi (Nasdaq:...
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Innodisk Releases the World’s First 10GbE LAN Module in M.2 Form Factor
- December 16, 2021
Innodisk Corporation (Taiwan) - Innodisk has announced its all-new EGPL-T101 M.2 2280 10GbE LAN module, the first 10GbE LAN designed in M.2 form facto...
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Innodisk Ultra Temperature DDR4 DRAM Module Beats the Heat up to 125℃
- November 03, 2021
Innodisk Corporation (Taiwan) - Innodisk has just released the first-of-its-kind Ultra Temperature DDR4 DRAM module that can operate from a chilling -...
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Quick-Action Integration via IO-Link
- October 24, 2021
Leuze Electronic (Germany) - New MD7 system from Leuze makes automation easier: IO-Link master, hubs and sensors enable high-performance systems to be...
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Article by Baykon Inc.: LAC Weigh Module Montage
- August 26, 2021
Baykon Inc. (Turkey) - LAC weigh module is mainly design for heavy capacity tank, hopper, reactor and conveyor scales. Thanks to Integrated anti-li...
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Article by Baykon Inc.: LAB RB Weigh Module Montage
- August 26, 2021
Baykon Inc. (Turkey) - BAYKON LAB weigh modules are designed for tank, hopper, reactor, conveyor and high capacity platform scales. Depending on opera...
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Article by Baykon Inc.: LAB FL Weigh Module Montage
- August 26, 2021
Baykon Inc. (Turkey) - BAYKON LAB weigh modules are designed for tank, hopper, reactor, conveyor and high capacity platform scales. Depending on opera...
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New Anyload MK4-Series Weigh Module Kits
- July 07, 2021
Anyload Weigh & Measure Inc. (Canada) - Press Release: Introducing MK4 Series Weigh Module Kits! Introducing the MK4-series weigh module kits f...
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Innodisk Releases Industrial-Grade DDR5 DRAM Modules
- June 21, 2021
Innodisk Corporation (Taiwan) - Innodisk has officially announced the release of its industrial-grade DDR5 DRAM modules. The new standard touts a host...
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Innodisk Releases CAN Bus Modules for Unmanned Smart Systems
- May 20, 2021
Innodisk Corporation (Taiwan) - Innodisk recently released their latest CAN Bus modules. With a complete line of form factors and strict industrial qu...
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Mettler Toledo Webinar - Next Level Tank Scales with POWERMOUNT Weigh Modules
- April 22, 2021
METTLER TOLEDO (Switzerland) - This live webinar will be presented on April 27 at 4 PM EDT. Moderator: Andy Kletrovets. Duration: 30 minutes. By at...
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Innodisk’s Industrial-Grade DRAM Modules—Rugged Reliability for FPGAs
- February 10, 2021
Innodisk Corporation (Taiwan) - Innodisk recently announced its industrial-grade DRAM modules for FPGA (field-programmable gate array) applications th...
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Cervoz 3D TLC Small Form Factor Product
- January 12, 2021
Cervoz Co., Ltd. (Taiwan) - Cervoz embedded modules fit even in the tightest spaces. Space constraints is one of the biggest challenges for embedde...
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Microchip Expands Silicon Carbide (SiC) Family of Power Electronics to Provide System Level Improvements in Efficiency, Size and Reliability
- May 07, 2020
Microchip Technology Inc. (United States) - 700, 1200 and 1700V SBD-based power modules maximize switching efficiency, reduce thermal rise and allow s...
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Innodisk Supports Healthcare Industry with Capable Medical-grade Solutions
- May 06, 2020
Innodisk Corporation (Taiwan) - Innodisk meets growing healthcare industry demands with DRAM modules, flash storage devices, and embedded peripherals...
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