Cervoz 3D TLC Small Form Factor Product

Cervoz 3D TLC Small Form Factor Product

Cervoz Co., Ltd. (Taiwan) - Cervoz embedded modules fit even in the tightest spaces.

Space constraints is one of the biggest challenges for embedded modules. As application devices have gotten smaller, embedded modules have had to shrink in size as well. Cervoz offers a range of embedded modules, equipped with the latest TLC technology, that comes in varying slim and compact form factors to accommodate your space constraints.

The two newest additions to the Titan Series are the Half Size mSATA and SATA Disk. Cervoz designed them according to the needs reflected by the industry for more compact form factor and versatile mounting. All products under the Titan Series come in both standard temperature (0˚C~70˚C) and wide temperature (-40˚C~85˚C) versions, so they can operate in the environment you need them to.

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