VIA Unveils VIA Smart Recognition Platform at Embedded World 2018

VIA Technologies, Inc. (Germany) – Speeds up development of facial & object recognition systems for boosting public safety and consumer convenience. V...

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VIA Announces VPai Clip2 Pro Turnkey Solution for 4K Ultra HD 360-Degree Cameras

VIA Technologies, Inc. (Taiwan) – Full suite of supply chain, manufacturing, QC, and logistics management services ensures the fastest time-to-market...

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VIA Announces VIA ARTiGO A630 Enterprise IoT Gateway System

VIA Technologies, Inc. (Taiwan) – Flexible space-saving design with rich connectivity options expands the VIA ARTiGO Series portfolio for wireless IoT...

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VIA Launches VIA SOM-9X20 Featuring Qualcomm® Snapdragon™ 820 Embedded Platform

VIA Technologies, Inc. (Taiwan) – Highly-integrated ultra-compact system-on-module accelerates development of next-generation Enterprise IoT and embed...

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VIA Launches VPai Slide 360-Degree Video Camera Platform

VIA Technologies, Inc. (Taiwan) – Highly-integrated solution accelerates time-to-market for iPhone®-compatible devices. VIA Technologies, Inc, announc...

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VIA Collaborates with Microsoft to Accelerate Internet of Things Solutions

VIA Technologies, Inc. (Taiwan) – Verified hardware and software enhance interoperability and allow faster time to production. VIA Technologies, Inc,...

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VIA Labs VL820 becomes the World’s First USB-IF Certified USB 3.1 Gen 2 Hub

VIA Technologies, Inc. (Taiwan) – Joins USB-IF Certified USB 3.1 Gen 2 Hosts and Devices to complete the SuperSpeed USB 10Gbps Ecosystem. VIA Labs, In...

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VIA Announces VIA Mobile360 ADAS Sample Kit

VIA Technologies, Inc. (Taiwan) – “Makes it dramatically easier for commercial fleet operators to enhance vehicle safety”. VIA Technologies, Inc., ann...

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Android Signage Goes Ultra HD with Introduction of VIA ALTA DS 4K

VIA Technologies, Inc. (Taiwan) – Enables retailers and restaurant operators to enhance customer engagement through stunning multimedia content and ne...

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VIA to Debut VIA VTS-8589 OPS Board at Embedded World 2017

VIA Technologies, Inc. (Taiwan) – VIA Technologies, Inc., announced the it will debut its new VIA VTS-8589 OPS board at the 2017 Embedded World Exhibi...

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VIA Launches VIA SOM-6X50 IoT Acceleration Platform for automated ticketing, signage, and kiosk devices

VIA Technologies, Inc. (Taiwan) – Flexible ultra-compact module will be on display at VIA Booth at Embedded World 2017. VIA Technologies, Inc., announ...

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VIA VAB-630 Platform Accelerates Smart Signage Innovation

VIA Technologies, Inc. (Taiwan) – Compact, highly-scalable solution for rich multimedia touch-screen and display applications. VIA Technologies, Inc,...

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VIA Launches Custom IoT Platform Design Service

VIA Technologies, Inc. (Taiwan) – Provides fastest & most flexible path for the design & manufacturing of application-specific IoT systems & devices....

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VIA ARTiGO A830 Powers Streetwise IoT Innovation

VIA Technologies, Inc. (Taiwan) - Customizable Android system accelerates development of smart O2O (online-to-offline) applications and services in ur...

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New VIA ETX-8X90-10GR Module Extends Life of ETX Devices

VIA Technologies, Inc. (Taiwan) - Five more years of ETX longevity complete with legacy software support. VIA Technologies, Inc, today introduced the...

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VIA unveils new ultra low-power VIA ETX-8X90-10GR ETX module

VIA Technologies, Inc. (Taiwan) - A performance-per-watt leader, the VIA ETX-8X90-10GR is a highly-integrated embedded multimedia module with native...

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VIA Introduces VIA ARTiGO A600 Smart Automation Control System

VIA Technologies, Inc. (Taiwan) - Integrates four isolated RS-485 COM ports and GPIO support in an ultra-compact fanless footprint. VIA Technologies,...

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VIA Technologies’ AMOS-820 rugged ARM system now with Power-over-Ethernet

VIA Technologies, Inc. (Taiwan) - The VIA AMOS-820 industrial system is an ultra-compact solution designed to take full advantage of the super power-e...

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