Enjoy Superior Graphic Output and Low Power Usage with Enhanced EBC 357X 3.5” Boards

NEXCOM International (Taiwan) - NEXCOM is thrilled to reintroduce the SBC EBC 357X series with a revamped design that withstands adverse temperatures...

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TECHBASE updates ModBerry M500 series

TECHBASE Group (Poland) - The latest version of Raspberry Pi development board, Raspberry Pi Model 3 B+, is now available as a platform for ModBerry M...

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New ARBOR 3.5 inch Compact Board with 6th Generation Intel® Core™ Processors

ARBOR Technology Corp. (Taiwan) – ARBOR Technology, a leading provider of embedded computing solutions, announces its 3.5 inch Compact Board EmCORE-i8...

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VIA to Debut VIA VTS-8589 OPS Board at Embedded World 2017

VIA Technologies, Inc. (Taiwan) – VIA Technologies, Inc., announced the it will debut its new VIA VTS-8589 OPS board at the 2017 Embedded World Exhibi...

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DFI Tech Announces New Line of Pico-ITX Boards

DFI Tech (USA) – DFI Tech, a provider of SWaP-optimized embedded computing solutions and board products, now offers a new product line of Pico-ITX boa...

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Introducing DFI’s Low Power Embedded Boards with Optimized and Thin-Profile Designs

DFI Inc. (Taiwan) - DFI (a leading provider offering a wide range of embedded products for industrial applications) announced four new embedded board...

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New 3U CompactPCI® Board from Kontron

Kontron AG (Germany) - Kontron delivers significant performance increases, power efficiencies and comprehensive I/O in new 3U CompactPCI® board. Based...

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